Method of forming electronic devices

专利名称：Method of forming electronic devices发明人：David Richard Esler,Donald Joseph

Buckley,Sandeep Shrikant Tonapi,JohnRobert Campbell,Ryan Christopher

Mills,Ananth Prabhakumar,Arun VirupakshaGowda

申请号：US11068376申请日：20050228

公开号：US20060192280A1公开日：20060831

专利附图：

摘要：A method of forming polymer reinforced solder-bumped containing device orsubstrate is described. The method comprises the following steps: providing a device orsubstrate having at least one solder bump formed thereon; coating a predeterminedportion of the device or substrate with a curable polymer reinforcement materialforming a layer on the device or substrate, partially curing the curable polymerreinforcement material to provide a solder-bumped structure comprising a partiallycured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads andfully curing the partially cured polymer reinforcement material to provide a reinforcedinterconnection. Full curing of the polymer reinforcement material may take place eitherduring the “reflow step” or subsequent to it (post-curing).

申请人：David Richard Esler,Donald Joseph Buckley,Sandeep Shrikant Tonapi,JohnRobert Campbell,Ryan Christopher Mills,Ananth Prabhakumar,Arun Virupaksha Gowda

地址：Mayfield NY US,Schenectady NY US,Niskayuna NY US,Clifton Park NYUS,Rexford NY US,Schenectady NY US,Schenectady NY US

国籍：US,US,US,US,US,US,US

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