Device manufacturing method and substrate processi

专利名称：Device manufacturing method and substrate

processing apparatus, and substratesupport structure

发明人：Thallner, Erich申请号：EP06004734.7申请日：20060308公开号：EP1832933B1公开日：20081001

摘要：A substrate (5; 42) can efficiently be manufactured by separating the alignmentand the actual processing when an alignment mark (6a, 6b; 12a...d; 44a...c) is provided,which is fixed with respect to the substrate (5; 42) and when position information on aposition of a process area on the substrate (5; 42) is retrieved with respect to thealignment mark (6a, 6b; 12a...d; 44a...c) before the substrate (5; 42) is processed. Duringthe processing alignment can then be performed by redetermining the position of thealignment mark (6a, 6b; 12a...d; 44a...c) only once and by using the stored positioninformation on the position of the process area.

申请人：THALLNER ERICH

地址：AT

国籍：AT

代理机构：Zinkler, Franz

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