专利名称：Method of encapsulating a semiconductor
device with a flame retardant epoxy moldingcompound
发明人：Anthony A. Gallo申请号：US07/418757申请日：19891005公开号：US05041254A公开日：19910820
摘要：An improved flame retardant epoxy molding compound comprises an epoxy, ahardener preferably of the novolac or anhydride type, a catalyst, a mold release agent,preferably a filler, preferably a colorant, preferably a coupling agent, an organiccompound containing a higher percent of halogen (which can be part of the resin or thehardener) , preferably the polyglycidyl ether of the bromophenol-formaldehyde novolactype, preferably containing at least about 1.0% of bromine by weight of the moldingcompound, a lower percent of sodium, preferably in the range of 0.01-0.06% by weight ofthe antimony pentoxide, a lower percent of antimony pentoxide, preferably in the rangeof from about 0.4 to about 0. 8% by weight of the molding compound, and an amount ofbismuth trioxide from about 1.6 to about 4.0% by weight of the molding compound. Theimproved flame retardant epoxy compounds when used to encapsulated semiconductordevices have improved high temperature stability and compatability, ball-lift
performance, live-device performance, cost and lower toxicity compared to similar priorart molding compounds.
申请人：DEXTER CORPORATION
代理机构：Pennie & Edmonds
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容