Method of manufacturing chemical mechanical polish

专利名称：Method of manufacturing chemical

mechanical polishing pad

发明人：Yukio Hosaka,Hiroyuki Tano,Hideki

Nishimura,Hiroshi Shiho

申请号：US115217申请日：20060915

公开号：US20070082587A1公开日：20070412

专利附图：

摘要：The present invention relates to a method of manufacturing a chemicalmechanical polishing pad which provides a chemical mechanical polishing pad which fully

suppresses the occurrence of a scratch on the polished surface and has an excellentpolishing rate. The method comprising either one of a group of steps (A) and a group ofsteps (B), the group of steps (A) including (A1) the step of preparing a composition forforming a chemical mechanical polishing pad; (A2) the step of molding the compositionfor forming a chemical mechanical polishing pad into a pad-like form; (A3) the step ofmounting the pad-like form on the round table of a cutting machine having at least amilling unit equipped with a milling cutter, a drive unit capable of angle indexing andpositioning and a round table journaled by the drive unit; (A4) the step of forming thesecond group of grooves with the milling cutter; and (A5) the step of forming the firstgroup of grooves, and the group of steps (B) including (B1) the step of preparing acomposition for forming a chemical mechanical polishing pad; (B2) the step of moldingthe composition for forming a chemical mechanical polishing pad into a pad-like formhaving the second group of grooves by using a metal mold having projectionscorresponding to the shapes of the second group of grooves; and (B3) the step offorming the first group of grooves.

申请人：Yukio Hosaka,Hiroyuki Tano,Hideki Nishimura,Hiroshi Shiho

地址：Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP

国籍：JP,JP,JP,JP

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