TC4423VOE资料

TC4423/TC4424/TC4425

3A Dual High-Speed Power MOSFET Drivers

Features

•High Peak Output Current: 3A

•Wide Input Supply Voltage Operating Range:-4.5V to 18V

•High Capacitive Load Drive Capability:-1800pF in 25ns

•Short Delay Times: <40ns (typ)•Matched Rise/Fall Times•Low Supply Current:

-With Logic ‘1’ Input – 3.5mA (Max)-With Logic ‘0’ Input – 350µA (Max)•Low Output Impedance: 3.5Ω (typ)

•Latch-Up Protected: Will Withstand 1.5A Reverse Current

•Logic Input Will Withstand Negative Swing Up To 5V

•ESD Protected: 4kV

•Pin compatible with the TC1426/TC1427/TC1428, TC4426/TC4427/TC4428 and TC4426A/TC4427A/TC4428A devices.

•Space-saving 8-Pin 6x5 DFN Package

General Description

The TC4423/TC4424/TC4425 devices are a family of3A, dual-output buffers/MOSFET drivers. Pin compati-ble with the TC1426/27/28, TC4426/27/28 andTC4426A/27A/28A dual 1.5A driver families, theTC4423/24/25 family has an increased latch-up currentrating of 1.5A, making them even more robust foroperation in harsh electrical environments.

As MOSFET drivers, the TC4423/TC4424/TC4425 caneasily charge 1800pF gate capacitance in under35nsec, providing low enough impedances in both theon and off states to ensure the MOSFET's intendedstate will not be affected, even by large transients.The TC4423/TC4424/TC4425 inputs may be drivendirectly from either TTL or CMOS (2.4V to 18V). Inaddition, the 300mV of built-in hysteresis providesnoise immunity and allows the device to be driven fromslowly rising or falling waveforms.

Applications

•Switch Mode Power Supplies•Pulse Transformer Drive•Line Drivers

Package Types(1)

8-Pin PDIPTC4423TC4424TC4425NCIN AGNDIN B

182TC442373TC4424TC44255NCOUT AVDDOUT BNCOUT AVDDOUT BNCOUT AVDDOUT B

16-Pin SOIC (Wide)TC4423TC4424TC4425

NCIN ANCGNDGNDNCIN BNC

123456781615141312111098-Pin DFN(2)TC4423TC4424TC4425

NC

1

8

TC4423TC4424TC4425

NCOUT AVDDOUT B

NCOUT AVDDOUT B

NCOUT AVDDOUT B

IN A2GND

3

TC4423TC4424TC4425

765

NCOUT AOUT AVDDVDDOUT BOUT BNCNCOUT AOUT AVDDVDDOUT BOUT BNCNCOUT AOUT AVDDVDDOUT BOUT BNC

IN B4

Note1:Duplicate pins must both be connected for proper operation.

2:Exposed pad of the DFN package is electrically isolated.

 2004 Microchip Technology Inc.DS21421D-page 1

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TC4423/TC4424/TC4425

Functional Block Diagram(1)

Inverting

750µA 300mV

VDD

Output

Input

Effective Input C = 20pF (Each Input)

GND

4.7V

Non-inverting

TC4423 Dual Inverting TC4424 Dual Non-inverting

TC4425 One Inverting, One Non-inverting

Note1:Unused inputs should be grounded.

DS21421D-page 2 2004 Microchip Technology Inc.

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TC4423/TC4424/TC4425

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Supply Voltage................................................................+22VInput Voltage, IN A or IN B

................................................(VDD + 0.3V) to (GND – 5V)Package Power Dissipation (TA ≤ 70°C)

DFN......................................................................... Note2PDIP.......................................................................730mWSOIC.......................................................................470mW† Notice: Stresses above those listed under \"MaximumRatings\" may cause permanent damage to the device. This isa stress rating only and functional operation of the device atthose or any other conditions above those indicated in theoperational sections of this specification is not intended.Exposure to maximum rating conditions for extended periodsmay affect device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V ≤ VDD ≤ 18V.

Parameters

Input

Logic ‘1’, High Input VoltageLogic ‘0’, Low Input VoltageInput CurrentOutput

High Output VoltageLow Output VoltageOutput Resistance, HighOutput Resistance, LowPeak Output CurrentLatch-Up Protection With-stand Reverse CurrentSwitching Time (Note1)Rise TimeFall TimeDelay TimeDelay TimePower SupplyPower Supply CurrentNote1:

2:

IS

——

1.50.15

2.50.25

mA

VIN = 3V (Both inputs)VIN = 0V (Both inputs)

tRtFtD1tD2

————

23253338

35357575

nsnsnsns

Figure4-1, Figure4-2, CL = 1800pF

Figure4-1, Figure4-2, CL = 1800pF

Figure4-1, Figure4-2, CL = 1800pF

Figure4-1, Figure4-2, CL = 1800pF

VOHVOLROHROLIPKIREV

VDD – 0.025

—————

——2.83.53>1.5

—0.02555——

VVΩΩAA

Duty cycle ≤ 2%, t ≤ 300µsec.IOUT = 10mA, VDD = 18VIOUT = 10mA, VDD = 18V

VIHVILIIN

2.4—–1

———

—0.81

VVµA

0V ≤ VIN ≤ VDD

Sym

Min

Typ

Max

Units

Conditions

Switching times ensured by design.

Package power dissipation is dependent on the copper pad area on the PCB.

 2004 Microchip Technology Inc.DS21421D-page 3

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TC4423/TC4424/TC4425

DC CHARACTERISTICS(OVER OPERATING TEMPERATURE RANGE)

Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V ≤ VDD ≤ 18V.

Parameters

Input

Logic ‘1’, High Input VoltageLogic ‘0’, Low Input VoltageInput CurrentOutput

High Output VoltageLow Output VoltageOutput Resistance, HighOutput Resistance, LowPeak Output CurrentLatch-Up Protection

Withstand Reverse CurrentSwitching Time (Note1)Rise TimeFall TimeDelay TimeDelay TimePower SupplyPower Supply Current

IS

——

2.00.2

3.50.3

mA

VIN = 3V (Both inputs)VIN = 0V (Both inputs)

tRtFtD1tD2

————

28323238

6060100100

nsnsnsns

Figure4-1, Figure4-2, CL = 1800pF

Figure4-1, Figure4-2, CL = 1800pF

Figure4-1, Figure4-2, CL = 1800pF

Figure4-1, Figure4-2, CL = 1800pF

VOHVOLROHROLIPKIREV

VDD – 0.025

—————

——3.74.33.0>1.5

—0.02588——

VVΩΩAA

Duty cycle ≤ 2%, t ≤ 300µsecIOUT = 10mA, VDD = 18VIOUT = 10mA, VDD = 18V

VIHVILIIN

2.4—–10

———

—0.8+10

VVµA

0V ≤ VIN ≤ VDD

Sym

Min

Typ

Max

Units

Conditions

Note1:Switching times ensured by design.

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.

Parameters

Temperature Ranges

Specified Temperature Range (C)Specified Temperature Range (E)Specified Temperature Range (V)Maximum Junction TemperatureStorage Temperature RangePackage Thermal ResistancesThermal Resistance, 8L-6x5 DFNThermal Resistance, 8L-PDIPThermal Resistance, 16L-SOIC

θJAθJAθJA

———

33.2125155

———

°C/W°C/W°C/W

Typical four-layer board with vias to ground plane

TATATATJTA

0–40–40—–65

—————

+70+85+125+150+150

°C°C°C°C°C

Sym

Min

Typ

Max

Units

Conditions

DS21421D-page 4 2004 Microchip Technology Inc.

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TC4423/TC4424/TC4425

2.0

Note:

TYPICAL PERFORMANCE CURVES

The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed hereinare not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.

1004700 pF801004700 pF80tFALL (nsec)tRISE (nsec)603300 pF2200 pF603300 pF2200 pF404020470 pF01500 pF1000 pF20470 pF01500 pF1000 pF4681012VDD (V)1416184681012VDD (V)141618FIGURE 2-1:Voltage.

100Rise Time vs. Supply

FIGURE 2-4:Voltage.

100Fall Time vs. Supply

805V80tFALL (nsec)5VtRISE (nsec)6010V15V6010V15V4040202001001000CLOAD (pF)10,00001001000CLOAD (pF)10,000FIGURE 2-2:Load.

323028Time (nsec)Rise Time vs. Capacitive

FIGURE 2-5:Load.

100Fall Time vs. Capacitive

CLOAD = 2200 pFtFALLDelay Time (nsec)80tD1CLOAD = 2200 pFVDD = 10V2624222018-55tFALLtRISE60tRISE4020tD2-35-15525TA (°C)658510512501234567Input (V)101112FIGURE 2-3:Temperature.

Rise and Fall Times vs.

FIGURE 2-6:Amplitude.

Propagation Delay vs. Input

 2004 Microchip Technology Inc.DS21421D-page 5

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TC4423/TC4424/TC4425

Typical Performance Curves (Continued)

50CLOAD = 2200 pF50CLOAD = 2200 pF45Delay Time (nsec)tD2Delay Time (nsec)4035302520tD2tD14035302520-55tD14681012VDD (V)141618-35-15525TA (°C)6585105125FIGURE 2-7:Supply Voltage.

TA = 25°CPropagation Delay Time vs.

FIGURE 2-10:Temperature.

1.4Propagation Delay Time vs.

1IQUIESCENT (mA)Both Inputs = 1IQUIESCENT (mA)1.21.00.80.60.40.2Both Inputs = 0-35-15525TA (°C)6585105125Both Inputs = 10.1Both Inputs = 00.014681012VDD (V)1416180.0-55FIGURE 2-8:Supply Voltage.

14121082468Quiescent Current vs.

FIGURE 2-11:Temperature.

1412Quiescent Current vs.

Worst Case @ TJ = +150°CRDS(ON) (Ω)RDS(ON) (Ω)1082Worst Case @ TJ = +150°CTypical @TA = +25°CTypical @TA = +25°C1012VDD (V)1416184681012VDD (V)141618FIGURE 2-9:Output Resistance (Output High) vs. Supply Voltage.FIGURE 2-12:Output Resistance (Output Low) vs. Supply Voltage.

DS21421D-page 6 2004 Microchip Technology Inc.

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TC4423/TC4424/TC4425

Typical Performance Curves (Continued)

Note: Load on single output only

60VDD = 18V60VDD = 18V3300 pF1000 pF504030355 kHz20200 kHz63.4 kHz35.5 kHz20 kHz01001000CLOAD (pF)10,000634 kHz50403020100ISUPPLY (mA)ISUPPLY (mA)10,000 pF100 pF10112.5 kHz10100Frequency (kHz)1000FIGURE 2-13:Capacitive Load.

908070ISUPPLY (mA)Supply Current vs.

FIGURE 2-16:Frequency.

908070VDD = 12VSupply Current vs.

VDD = 12V3300 pF1000 pF2 MHz60504030201001001000CLOAD (pF)ISUPPLY (mA)605040302010010100Frequency (kHz)100010,000 pF100 pF1.125 MHz200 kHz112.5 kHz63.4 kHz20 kHz10,000634 kHz355 kHzFIGURE 2-14:Capacitive Load.

120VDD = 6VSupply Current vs.

FIGURE 2-17:Frequency.

120VDD = 6VSupply Current vs.

4700 pF10,000 pF100801.125 MHz60402 MHz2001003.55 MHz634 kHz355 kHz112.5 kHz20 kHz1000CLOAD (pF)10,000ISUPPLY (mA)10080ISUPPLY (mA)2200 pF601000 pF4020010100 pF100Frequency (kHz)1000FIGURE 2-15:Capacitive Load.

Supply Current vs.

FIGURE 2-18:Frequency.

Supply Current vs.

 2004 Microchip Technology Inc.DS21421D-page 7

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TC4423/TC4424/TC4425

Typical Performance Curves (Continued)

10-782A • sec10-88210-9024681012141618VIN (V) Note:The values on this graph represent the lossseen by both drivers in a package during onecomplete cycle. For a single driver, divide thestated values by 2. For a single transition of asingle driver, divide the stated value by 4.FIGURE 2-19:TC4423 Crossover Energy.

DS21421D-page 8 2004 Microchip Technology Inc.

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TC4423/TC4424/TC4425

3.0

PIN DESCRIPTIONS

PIN FUNCTION TABLE (1)

8-PinDFN12—3——4——5—6—7—8PAD

16-Pin SOIC (Wide)123456710111213141516—

SymbolNCIN ANCGNDGNDNC

IN B NC

NCOUT BOUTBVDDVDDOUT AOUT ANCNC

No connectionInput ANo connectionGroundGroundNo connectionInput B No connectionNo connectionOutput BOutputBSupply inputSupply inputOutput AOutput ANo connectionExposed Metal Pad

Description

The descriptions of the pins are listed in Table3-1.

TABLE 3-1:

8-Pin PDIP

12—3——4——5—6—7—8—Note1:

Duplicate pins must be connected for proper operation.

3.1Inputs A and B3.4Ground (GND)

Inputs A and B are TTL/CMOS compatible inputs thatcontrol outputs A and B, respectively. These inputshave 300mV of hysteresis between the high and lowinput levels, allowing them to be driven from slow risingand falling signals, and to provide noise immunity.Ground is the device return pin. The ground pin(s)should have a low-impedance connection to the biassupply source return. High peak currents will flow outthe ground pin(s) when the capacitive load is beingdischarged.

3.2Outputs A and B3.5Exposed Metal Pad

Outputs A and B are CMOS push-pull outputs that arecapable of sourcing and sinking 3A peaks of current(VDD = 18V). The low output impedance ensures thegate of the external MOSFET will stay in the intendedstate even during large transients. These outputs alsohave a reverse current latch-up rating of 1.5A.

The exposed metal pad of the 6x5 DFN package is notinternally connected to any potential. Therefore, thispad can be connected to a ground plane or other cop-per plane on a printed circuit board to aid in heatremoval from the package.

3.3

Supply Input (VDD)

VDD is the bias supply input for the MOSFET driver andhas a voltage range of 4.5V to 18V. This input must bedecoupled to ground with a local ceramic capacitor.This bypass capacitor provides a localized low-impedance path for the peak currents that are to beprovided to the load.

 2004 Microchip Technology Inc.DS21421D-page 9

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TC4423/TC4424/TC4425

4.0

APPLICATIONS INFORMATION

VDD = 18V1µFWIMA MKS-2

Input

12

0.1µFCeramicOutput CL = 1800pF

Input

12VDD = 18V1µFWIMA MKS-2

0.1µFCeramicOutput CL = 1800pF

TC4423(1/2 TC4425)

Input: 100kHz, square wave,

tRISE = tFALL ≤ 10ns

+5VInput0V18VOutput

0V

10%

10%

10%

tD190%

tF

tD2

tR

90%

0V18VOutput

0V

90%

+5VInput

10%

TC4424(1/2 TC4425)

Input: 100kHz, square wave,

tRISE = tFALL ≤ 10ns

90%

tD190%10%

tR

tD2

90%

tF

10%FIGURE 4-1:Time.

Inverting Driver Switching

FIGURE 4-2:Switching Time.

Non-inverting Driver

DS21421D-page 10 2004 Microchip Technology Inc.

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TC4423/TC4424/TC4425

5.0

5.1

PACKAGING INFORMATION

Package Marking Information

8-Lead DFN

Example:

XXXXXXXXXXXXXXXXYYWWNNNTC4423EMF04202568-Lead PDIP (300 mil)

XXXXXXXXXXXXXNNNYYWWExample:

TC4423CPA256042016-Lead SOIC (300 mil)Example:

XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXYYWWNNNTC4423COE0420256Legend: XX...X

YYWWNNNNote:

Customer specific information*

Year code (last 2 digits of calendar year)Week code (week of January 1 is week ‘01’)Alphanumeric traceability code

In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line thus limiting the number of available charactersfor customer specific information.

*

Standard marking consists of Microchip part number, year code, week code, traceability code (facilitycode, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Pleasecheck with your Microchip Sales Office.

 2004 Microchip Technology Inc.DS21421D-page 11

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TC4423/TC4424/TC4425

8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw SingulatedDS21421D-page 12 2004 Microchip Technology Inc.

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TC4423/TC4424/TC4425

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A

A2

c

L

A1

β

eB

B1

p

B

Number of PinsPitch

Top to Seating Plane

Molded Package ThicknessBase to Seating Plane

Shoulder to Shoulder WidthMolded Package WidthOverall Length

Tip to Seating PlaneLead ThicknessUpper Lead WidthLower Lead WidthOverall Row SpacingMold Draft Angle TopMold Draft Angle Bottom* Controlling Parameter§ Significant Characteristic

Units

Dimension Limits

npAA2A1EE1DLcB1BeBαβ

MIN

INCHES*NOM

8.100.155.130.313.250.373.130.012.058.018.3701010

MAX

§

.140.115.015.300.240.360.125.008.045.014.31055

.170.145.325.260.385.135.015.070.022.4301515

MILLIMETERS

MINNOM

82.

3.563.942.923.300.387.627.946.106.359.149.463.183.300.200.291.141.460.360.467.879.40510510

MAX

4.32

3.688.266.609.783.430.381.780.5610.921515

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.2mm) per side.JEDEC Equivalent: MS-001Drawing No. C04-018

 2004 Microchip Technology Inc.DS21421D-page 13

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TC4423/TC4424/TC4425

16-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)

E

p

E1

D

2

n

B

h

1

α

45°

c

A

A2

β

Units

Dimension Limits

npAA2A1EE1DhLφcBαβ

φL

A1

INCHES*NOM

16.050.099.091.008.407.295.406.020.0334.011.0171212

MILLIMETERS

MINNOM

161.27

2.362.502.242.310.100.2010.0110.347.397.4910.1010.300.250.500.410.84040.230.280.360.42012012

MINMAXMAX

Number of Pins

Pitch

Overall Height

Molded Package ThicknessStandoff§Overall Width

Molded Package WidthOverall LengthChamfer DistanceFoot LengthFoot Angle

Lead ThicknessLead Width

Mold Draft Angle TopMold Draft Angle Bottom* Controlling Parameter§ Significant Characteristic

.093.088.004.394.291.398.010.0160.009.01400.104.094.012.420.299.413.029.0508.013.02015152.2.390.3010.677.5910.490.741.2780.330.511515

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.2mm) per side.JEDEC Equivalent: MS-013Drawing No. C04-102

DS21421D-page 14 2004 Microchip Technology Inc.

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TC4423/TC4424/TC4425

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.PART NO.Device

Device:

TC4423:TC4424:TC4425:CEV

===

3A Dual MOSFET Driver, Inverting

3A Dual MOSFET Driver, Non-Inverting 3A Dual MOSFET Driver, Complementary0°C to +70°C (PDIP & SOIC Only)-40°C to +85°C-40°C to +125°C

XTemperatureRange

XXPackage

XXXTape & Reel

XPB Free

Examples:a)

TC4423COE:

3A Dual InvertingMOSFET Driver,

0°C to +70°C,16LD SOIC package.

b)

TC4423CPA: 3A Dual Inverting

MOSFET Driver,

0°C to +70°C,8LD PDIP package.

c)

TC4423VMF:

3A Dual InvertingMOSFET Driver,

Temperature Range:

-40°C to +125°C,8LD DFN package.

a)

TC4424COE713:

3A Dual Non-Inverting,MOSFET Driver,

Package:

MF=Dual, Flat, No-Lead (6x5 mm Body), 8-leadMF713=Dual, Flat, No-Lead (6x5 mm Body), 8-lead

(Tape and Reel)

OE=SOIC (Wide), 16-pin

OE713=SOIC (Wide), 16-pin (Tape and Reel)PA=Plastic DIP, (300 mil body), 8-leadG

=Lead-Free device *

=Blank

0°C to +70°C,16LD SOIC package,Tape and Reel.

b)

TC4424EPA:

3A Dual Non-Inverting,MOSFET Driver,

PB Free:

-40°C to +85°C,8LD PDIP package.

a)

TC4425EOE: 3A Dual Complementary,

MOSFET Driver,

* Available on selected packages. Contact your local sales representative for availability.

-40°C to +85°C,16LD SOIC package.

b)

TC4425CPA:

3A Dual Complementary,MOSFET Driver,

0°C to +70°C,PDIP package.

Sales and SupportData Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:1.2.3.

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2004 Microchip Technology Inc.DS21421D-page 15

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TC4423/TC4424/TC4425

NOTES:

DS21421D-page 16 2004 Microchip Technology Inc.

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Note the following details of the code protection feature on Microchip devices:•••

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

••

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is intended through suggestion onlyand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.No representation or warranty is given and no liability isassumed by Microchip Technology Incorporated with respectto the accuracy or use of such information, or infringement ofpatents or other intellectual property rights arising from suchuse or otherwise. Use of Microchip’s products as criticalcomponents in life support systems is not authorized exceptwith express written approval by Microchip. No licenses areconveyed, implicitly or otherwise, under any intellectualproperty rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PROMATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,

PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

© 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

 2004 Microchip Technology Inc.DS21421D-page 17

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WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: 480-792-7627Web Address:

www.microchip.comAtlanta

Alpharetta, GA Tel: 770-0-0034 Fax: 770-0-0307Boston

Westford, MA Tel: 978-692-3848 Fax: 978-692-3821ChicagoItasca, IL

Tel: 630-285-0071 Fax: 630-285-0075Dallas

Addison, TX

Tel: 972-818-7423 Fax: 972-818-2924Detroit

Farmington Hills, MI Tel: 248-538-2250Fax: 248-538-2260KokomoKokomo, IN

Tel: 765-8-8360Fax: 765-8-8387Los Angeles

Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608San Jose

Mountain View, CA Tel: 650-215-1444Fax: 650-961-0286Toronto

Mississauga, Ontario, Canada

Tel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFIC

Australia - SydneyTel: 61-2-9868-6733 Fax: 61-2-9868-6755China - Beijing

Tel: 86-10-8528-2100 Fax: 86-10-8528-2104China - Chengdu

Tel: 86-28-8676-6200 Fax: 86-28-8676-6599China - Fuzhou

Tel: 86-591-750-3506 Fax: 86-591-750-3521China - SARTel: 852-2401-1200 Fax: 852-2401-3431China - ShanghaiTel: 86-21-6275-5700 Fax: 86-21-6275-5060China - ShenzhenTel: 86-755-8290-1380 Fax: 86-755-8295-1393China - Shunde

Tel: 86-757-2839-5507 Fax: 86-757-2839-5571China - Qingdao

Tel: 86-532-502-7355 Fax: 86-532-502-7205

ASIA/PACIFIC

India - BangaloreTel: 91-80-2229-0061 Fax: 91-80-2229-0062India - New DelhiTel: 91-11-5160-8632Fax: 91-11-5160-8632Japan - KanagawaTel: 81-45-471- 6166 Fax: 81-45-471-6122Korea - Seoul

Tel: 82-2-5-7200 Fax: 82-2-558-5932 or 82-2-558-5934Singapore

Tel: 65-6334-8870 Fax: 65-6334-8850Taiwan - KaohsiungTel: 886-7-536-4816Fax: 886-7-536-4817Taiwan - Taipei

Tel: 886-2-2500-6610 Fax: 886-2-2508-0102Taiwan - HsinchuTel: 886-3-572-9526Fax: 886-3-572-59

EUROPE

Austria - Weis

Tel: 43-7242-2244-399Fax: 43-7242-2244-393Denmark - BallerupTel: 45-4420-95 Fax: 45-4420-9910France - Massy

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79Germany - IsmaningTel: 49--627-144-0 Fax: 49--627-144-44Italy - Milan

Tel: 39-0331-742611 Fax: 39-0331-466781Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340England - BerkshireTel: 44-118-921-5869Fax: 44-118-921-5820

08/24/04

DS21421D-page 18 2004 Microchip Technology Inc.