Lead frame including frame-cutting slit for lead-o

专利名称：Lead frame including frame-cutting slit for

lead-on-chip (LOC) semiconductor deviceand semiconductor device incorporating thelead frame

发明人：Yoshihiro Tomita,Naoto Ueda,Yoshirou

Nishinaka,Shunichi Abe,Hideyuki Ichiyama

申请号：US09/050397申请日：19980331公开号：US05900582A公开日：19990504

摘要：A leadframe for producing a semiconductor device having a lead- on chip (LOC)structure with leads extending across a semiconductor chip, the leadframe includes aframe for a die pad having an outer frame section, a die pad displaced from the outerframe section, and a suspending lead connecting the die pad to the outer frame sectionwith the die pad disposed inside the outer frame section; and a frame for leads includingan outer frame portion and leads extending from opposite sides of the outer frameportion, connected to the frame for a die pad, the die pad being connected to the framefor leads at the suspending lead, wherein one of the frame for a die pad and the framefor leads includes a projection and the other of the frame for a die pad and the frame forleads includes a hole, the hole receiving the projection, the projection being disposedparallel to the frame for leads, connecting the frame for a die pad to the frame for leads.

申请人：MITSUBISHI DENKI KABUSHIKI KAISHA

代理机构：Leydig, Voit & Mayer

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